THz silicon-integrated camera for low-cost imaging applications (TiCAM)
The goal of TICAM is to improve the system sensitivity in such a way that near real time passive imaging can be realized in silicon technology, with temperature resolution lower than 1K. The target improvements rely on the cross-expertise of the research team composing TiCAM, providing competences in the three key areas required to develop THz integrated systems: antennas, integrated circuit design and device modeling. These competences have not been jointly addressed by other research groups active in this field due to the lack of combined front-end design (antennas and circuits), characterization and modeling expertise. By efficiently employing an ultra large detection bandwidth, reducing the active device noise contribution and truly co-designing the system front-end, the sensitivity of passive imagers can be increased by a factor 20.
Overall TiCAM will demonstrate a multi pixel passive radiometer (e.g., 1 thousand elements), operating between 0.1 THz and 1THz integrated in a silicon based technology. This will enable sub kelvin temperature imaging in less than one second, reaching the sensitivity requirement for typical security scenarios.
|Researchers:||Sven van Berkel, Satoshi Malotaux, Carmine De Martino, Daniele Cavallo, Nuria Llombart, Marco Spirito, Andrea Neto|
|Starting date:||January 2013|
|Closing date:||January 2017|
|Funding:||750 kE; related to group 750 kE|