MSc thesis project proposal
Physics and applications of cryogenically superconductive vias
Through-silicon vias (TSVs) have been enabling high-density, three-dimensional interconnections among integrated circuits for the past decade, and are by now an established microfabrication technology. Yet further applications, such as high-density quantum computing systems and cryogenic sensors, may be unleashed only by a successful implementation of cryogenically superconductive vias. In the past few years, research at the Electronic Components, Technology and Materials group (ECTM) of TU Delft has been targeting such ambitious and still elusive goal, whose attainment and complete understanding requires a rich blend of physics, materials and microfabrication knowledge.
The aim of this project is to tailor and characterise application-specific cryogenically superconductive vias. Building onto the group’s knowledge, the project will help develop a deeper understanding of material and processing aspects of superconductive vias towards their use for innovative applications.
This experimental project will involve:
• an extensive review of the related state-of-the-art;
• mastering the process flows for vias fabrication developed at the Else Kooi Lab (EKL) of TU Delft;
• the deployment of updated or novel process flows, and of specific use of microfabrication tools available at EKL, for the design and implementation of the structures;
• the characterization of the electrical performance of the structures and of their sensitivity to design and material parameters;
• comprehensive reporting of the full experimental work.
You are an ambitious hands-on master student from mechanical engineering, materials science or (applied) physics. You have good communication skills in English, you are independent and also a team player. The graduation project will have a total duration of 9 to 12 months.
If you are eager to work in a motivating atmosphere with highly skilled colleagues, then send us your CV!
dr. Massimo Mastrangeli
Electronic Components, Technology and Materials Group
Department of Microelectronics
Last modified: 2018-10-31